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China will become the world's fastest growing PCB Market
The United States of America electronic information industry consulting company Prismark analysis report, from 2010 to 2015, China will be nearly 10% compound annual growth rate to become the world's fastest growing PCB market.To 2015, Chinese market HDI PCB output proportion will be 42% now increased to 50%.In May this year, s technology and system technology company (AT&S) announced that its market strategy in China, will improve productivity and market share, to meet for intelligent mobile phone and computer market with the rapid growth and brings for the global high-end printed circuit board (PCB) product requirements.According to the company 2011/12 year the second quarter financial report: AT&S sales in the second quarter reached 131400000 euros, operating profit of 15000000 euros, a history best level.It is worth mentioning that, 60% of the second quarters of the total profit from Chinese market.
According to Otis Ge Simai (CEO Andreas Gesternmayer) said, "so far in China, s market for a total investment of 700000000 us dollars.We have just completed the last Shanghai factory production line put into production, Chongqing factory has also started construction, progress smoothly.At the end of 2011 7, the Shanghai factory capacity to achieve full load.3 new production lines in May of this year and put into operation in August, once again confirms the high-end PCB products blowout growth and demand.Overall, the Shanghai factory capacity is increased 30% to achieve annual output of 710000 square meters (technically a maximum capacity)."Because factories in Shanghai land reserve and production capacity are completely exhausted, Otis in China's western city of Chongqing established a new manufacturing base, in order to satisfy the increasing demand.Ge Simai said, "this year the investment of the new factory in Chongqing, will be divided into three periods of construction, a total area of 125000 square meters, in 2013 the start of production.At present, the first phase of construction was completed in 2011 June start, progress smoothly, we will be in accordance with customer needs and new technology the installation of the necessary infrastructure and equipment."Although the investment in the western city, but from the factory equipment technology to produce products with Shanghai factory no difference can be seen, not for lower cost and in the Midwest to set up factories in foundry practice.
According to the International Telecommunication Union says, China and India, effectively promoted the development of mobile equipment.At the same time, the National Bureau of statistics of China in 2011 February data also shows that, as of 2010 December, China has 850000000 mobile phone users, accounting for 64% of the total population; wherein, 3G mobile phone users for 47000000 people.As the mobile consumer market center, China s global market plays a more and more important role, in which the mobile device business annual income of more than 60% from china.Because the whole China mobile devices in the supply chain of the important position, s decided to mobile devices division headquarters moved to Shanghai, China, this not only shows up on the Asian market confidence, more reflect s have become mobile equipment market important suppliers.
In addition to the rapid growth of the consumer electronics market, s of high-end PCB products also widely used in automotive and industrial electronics, this several areas of PCB itself technology upgrade have very large craving, how to increase the density of PCB and reduce the thickness of PCB is the PCB manufacturers want things each.In the aspect of technical innovation, the introduction of the element s embedded package patented ECP technology efficiently will be active and passive components are integrated in a printed circuit board, suitable for the size as small as possible, function as much as possible electronic products.The traditional concept of the electronic product is packaged semiconductor chip loading to the PCB, and the ECP technology in the existing package approach provides another option, so the PCB can even enter in packaging field.Ge Simai in response to a reporter about packaging and testing companies may have to the downstream integration PCB business issues, said: "in fact, technology development so that we have the opportunity to enter into the packaging market."SiB (System in Board) and SiP (System in Package) the two concepts as a result of technical development and gradually moved towards the fusion.Due to high-end PCB linewidth is smaller and smaller, high-end manufacturers PCB production technology is more and more close to the chip maker, can shop in Oates saw a lot of photoetching machine wafer manufacturing factory, then in general.
According to Otis Ge Simai (CEO Andreas Gesternmayer) said, "so far in China, s market for a total investment of 700000000 us dollars.We have just completed the last Shanghai factory production line put into production, Chongqing factory has also started construction, progress smoothly.At the end of 2011 7, the Shanghai factory capacity to achieve full load.3 new production lines in May of this year and put into operation in August, once again confirms the high-end PCB products blowout growth and demand.Overall, the Shanghai factory capacity is increased 30% to achieve annual output of 710000 square meters (technically a maximum capacity)."Because factories in Shanghai land reserve and production capacity are completely exhausted, Otis in China's western city of Chongqing established a new manufacturing base, in order to satisfy the increasing demand.Ge Simai said, "this year the investment of the new factory in Chongqing, will be divided into three periods of construction, a total area of 125000 square meters, in 2013 the start of production.At present, the first phase of construction was completed in 2011 June start, progress smoothly, we will be in accordance with customer needs and new technology the installation of the necessary infrastructure and equipment."Although the investment in the western city, but from the factory equipment technology to produce products with Shanghai factory no difference can be seen, not for lower cost and in the Midwest to set up factories in foundry practice.
According to the International Telecommunication Union says, China and India, effectively promoted the development of mobile equipment.At the same time, the National Bureau of statistics of China in 2011 February data also shows that, as of 2010 December, China has 850000000 mobile phone users, accounting for 64% of the total population; wherein, 3G mobile phone users for 47000000 people.As the mobile consumer market center, China s global market plays a more and more important role, in which the mobile device business annual income of more than 60% from china.Because the whole China mobile devices in the supply chain of the important position, s decided to mobile devices division headquarters moved to Shanghai, China, this not only shows up on the Asian market confidence, more reflect s have become mobile equipment market important suppliers.
In addition to the rapid growth of the consumer electronics market, s of high-end PCB products also widely used in automotive and industrial electronics, this several areas of PCB itself technology upgrade have very large craving, how to increase the density of PCB and reduce the thickness of PCB is the PCB manufacturers want things each.In the aspect of technical innovation, the introduction of the element s embedded package patented ECP technology efficiently will be active and passive components are integrated in a printed circuit board, suitable for the size as small as possible, function as much as possible electronic products.The traditional concept of the electronic product is packaged semiconductor chip loading to the PCB, and the ECP technology in the existing package approach provides another option, so the PCB can even enter in packaging field.Ge Simai in response to a reporter about packaging and testing companies may have to the downstream integration PCB business issues, said: "in fact, technology development so that we have the opportunity to enter into the packaging market."SiB (System in Board) and SiP (System in Package) the two concepts as a result of technical development and gradually moved towards the fusion.Due to high-end PCB linewidth is smaller and smaller, high-end manufacturers PCB production technology is more and more close to the chip maker, can shop in Oates saw a lot of photoetching machine wafer manufacturing factory, then in general.
Due to the recent European debt crisis, the global economic prospect is unoptimistic, which Ge Simai said, "given the current macroeconomic environment, HDI products demand growth prospects uncertain, it is difficult to make a forecast.However, market fundamentals will change, also show more attractive medium-term growth rate.If consumer spending remained unchanged, at the current level of exchange rate changes is not increased, and Europe and the United States economy does not appear as in 2008 suddenly glides considerably, we can also make some short-term forecast.However, the Christmas holidays and consumer behavior will produce important influence on market performance."
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